Analog IC Turnkey Service

A Turnkey Service for Analog ICs, Pursuing Reliability and Innovation.
SANEI HYTECHS provides turnkey services for "mixed-signal ICs including small-scale logic" and "analog ICs." We offer tailored proposals by selecting the optimal fabrication (manufacturing) facility from both domestic and international options, based on our customers' budgets and development schedules.

Our turnkey services leverage proprietary Silicon-Proven IP and analog process porting technology to deliver high-performance ICs in a short timeframe, a capability unmatched by competitors. This significantly reduces development risks and drastically shortens development periods. We specialize in developing ICs with integrated sensor input circuits and ADCs (Analog-to-Digital Converters). We're also currently developing a sensor AFE (Analog Front-End) platform. This platform will enable us to provide optimal solutions for a wide range of your sensor applications. We offer comprehensive support throughout the entire product lifecycle. We'll recommend the most suitable domestic and international foundries based on your requirements, and we'll select the appropriate package manufacturers and test houses to build an optimized supply chain. We offer flexible delivery options, whether you prefer wafers, bare dies, or packaged parts. From prototyping and small-volume production to mass production, we provide end-to-end support to meet all your needs and help you bring your products to market.
Development Flow

Features of Analog IC Turnkey Services

We offer turnkey services that support every stage of IC development, leveraging our extensive experience in designing analog and mixed-signal ICs.
From product planning and development to prototyping, mass production, and testing, we provide seamless, end-to-end support tailored to our customers' specific needs.

Proposal of Development Plans

We will propose development plans for prototyping and mass production that best meet our customers' requirements. Taking into account development schedules and costs, we will efficiently bring your product to life through an optimized process.

High-Performance, Rapid IC Prototyping

Leveraging our proprietary Silicon-Proven IP and analog process porting technology, SANEI HYTECHS can rapidly prototype ICs with superior analog performance, a capability unmatched by competitors.

Our Expertise

We specialize in the design and development of ICs incorporating sensor input circuits, ADCs, and more. We are also developing a next-generation Sensor AFE (Analog Front End) platform.

Optimal Foundry Selection

Based on customer requirements and IC specifications, we propose the most suitable domestic and international foundries. Examples of Supported Foundries: TSMC, X-FAB, UMC, ams-OSRAM, etc.

Comprehensive Support from Packaging to Testing

Through collaboration with partner companies, we select the optimal package manufacturers and test houses, offering end-to-end support from packaging to testing.

Flexible Product Delivery Formats

We offer delivery in various product forms, such as wafers, bare chips, or packaged components, according to our customers' requirements. We select the optimal form based on the product's characteristics and applications, ensuring customer satisfaction by providing products that meet their needs.

Versatile Process and Task Adaptability

We cater to our customers' requests regarding various stages and tasks.

Support for Small-scale Production and Prototyping

We also accommodate the manufacturing of small-scale production and prototype items. Whether it's prototyping or initial low-volume production, we ensure prompt delivery of high-quality products.

Turnkey service

A turnkey service involves our company managing the entire process from design to prototyping and mass production, based on the specifications provided by the customer.
Customers need only supply the specification document; there is no requirement for them to provide specialized knowledge or resources.
Furthermore, at the customer's request, we provide regular progress reports during the design and prototyping phases.
  • 01

    Planning (Customer)
  • 02

    Design (SANEI HYTECHS)
  • 03

    Prototyping (SANEI HYTECHS)
  • 04

    Mass Production (SANEI HYTECHS)

01Planning (Customer)

  • Specification Requirements

02Design (SANEI HYTECHS)

  • Design Review
  • Feasibility Study
  • Circuit Design
  • Layout Design
  • Design Finalization Review

03Prototyping (SANEI HYTECHS)

  • Wafer Fabrication, Packaging
  • Electrical Characterization, Fault Analysis
  • Reliability Testing
  • Test Development
  • Prototyping Completion Review

04Mass Production (SANEI HYTECHS)

  • Wafer Fabrication, Packaging
  • Shipping Inspection

Sensor AFE Platform

Sensor AFE platform that shortens design periods and accelerates customer product development.
Leveraging our Silicon-Proven IP and microcontrollers, we've developed a comprehensive framework—the Sensor AFE Platform—to meet diverse analog front-end needs for various sensors. This platform is available for both our turnkey services and custom design services. By utilizing the Sensor AFE Platform, we offer a design solution that significantly reduces development risks and shortens development cycles. We achieve this by providing end-to-end support, from mixed-signal IC design (including our Silicon-Proven IP, proven analog design techniques, and digital design techniques for microcontrollers) to layout, prototyping, and evaluation.

We also flexibly accommodate diverse customer needs, including the reuse of existing circuits and process porting. To help you assess the utility of our Silicon-Proven IP for your sensor AFE (Analog Front-End) needs, we are developing promotional ICs. Our platform is designed to support a wide range of sensors, including current, voltage, optical, magnetic, pressure, and ultrasonic sensors.
Sensor AFE IC (Under development)
Sensor AFE IC (Under development)
Features
  • 12bit/16bit/24bit ADC
  • 12bit/16bit DAC
  • Sensor Amp:PGA.TIA
  • 1.8V Capless LDO+HV LDO
  • On-chip OSC. Voltage Reference
  • MCU(RISC-V core) + RAM/ROM
Process TMSC 0.18μm BCD Gen2 1.8V/5V/HV
QFN80 Package
Development Schedule May 2025: Tape Out
September 2025: Evaluation Scheduled to Commence

Partner

Wafer Foundry Partners

X-FAB Silicon Foundries SE
X-FAB Silicon Foundries SE
ams-OSRAM AG
ams-OSRAM AG

Packaging and Testing Partners

ARS Co., Ltd.
ARS Co., Ltd.
TOYO ELECTRONICS Co.,LTD
TOYO ELECTRONICS Co.,LTD
Our Analog IC Turnkey Service is designed to support flexible product development and manufacturing tailored to our customers' needs. If you have any specific requirements or inquiries, please don't hesitate to contact us. We are here to assist you.