Notice of signed a Memorandum of Understanding (MOU) with CMSC, Inc. of Taiwan to move towards an agency agreement.

On June 12, 2024, SANEI HYTECHS have signed a Memorandum of Understanding (MOU) with Taiwan's ASIC turnkey vendor, CMSC, Inc., to move towards an agency agreement.
By becoming an agent for CMSC, Inc., SANEI HYTECHS will expand our existing semiconductor business (analog/digital/layout design, LSI evaluation/analysis, custom IC development, IP sales) to include foundry services, assembly services, and testing services. This will enable us to offer comprehensive ASIC business services, encompassing both design and manufacturing.